| 摘要 |
PROBLEM TO BE SOLVED: To obtain an insulating resin composition for printed-wiring boards which maintains stabilized material characteristics for a long period of time in its production and has excellent properties such as high adhesion of circuit patterns, formability of fine patterns, high heat resistance, and a low coefficient of thermal expansion. SOLUTION: The insulating layers of a multi-layered printed-wiring board are prepared by a dilute alkaline solution-developable, photocurable and thermosetting insulating resin composition for multi-layered printed-wiring boards comprising at least (A) an ultraviolet curable resin to be obtained by reacting a polycarboxylic acid obtained by reacting a reaction product of an epoxy resin compound with an unsaturated monocarboxylic acid with a saturated or unsaturated polybasic acid anhydride with an aliphatic vinyl ether compound as the photocurable resin, (B) a polyfunctional epoxy resin as the thermosetting component, and (C) a photopolymerization initiator. |
