| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in adhesion to the surface of a semiconductor element or the surface of a lead frame by mixing an epoxy resin with a phenolic resin and a mold release containing an aliphatic monocarboxylic acid ester and an aromatic dicarboxylic acid ester. SOLUTION: The epoxy resin used is the one represented by formula I (wherein R is a 1-6C alkyl or a halogen; (n) and (m) are each 0-4; and R' is H or a 1-4C alkyl). The mold release used is the one comprising a compound represented by formula II and a compound represented by formula III. In the formulae, (k) is 12-18; (j) is 30-40; and (m) is 40-60. The mixing ratio of the epoxy resin to the phenolic resin is desirably such that 0.8-1.2 equivalents of the hydroxyl groups of the phenolic resin are present per equivalent of the epoxy groups of the epoxy resin. The mixing ratio of compound of formula II/compound of formula II is desirably 7/3 to 3/7, and the amount of the mold release component containing both is desirably 0.1-1.0 wt.% based on the entire composition.
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