发明名称 THIN FILM FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To vacuum-deposit a vapor depositing material on the face to be vapor-deposited to an optional pattern by arranging a forcusing electrode, an acceleration controlling electrode and a deflecting electrode on the space between an electrode in a crucible and an electrifying electrode in the face to be vapor-deposited in a vacuum device. SOLUTION: In an electrode 1 in a crucible having fine pores, a vapor depositing material is evaporated, the pressure at the inside is controlled to the relatively high one, it is blown off from the small pores, is ionized by using a grid 3 and a heat cathode for ionization in the following chamger, is made into the shape of a finer beam by a forcusing electrode 8 and is deflected by deflecting electrodes A, A', B and B', and an optional pattern is crashed into the face 10 to be vapor-deposited to form a thin film.
申请公布号 JP2000212730(A) 申请公布日期 2000.08.02
申请号 JP19990015109 申请日期 1999.01.25
申请人 NISHIHARA KAZUO;YAMAUCHI SHOKO 发明人 NISHIHARA KAZUO;YAMAUCHI SHOKO
分类号 C23C14/24;(IPC1-7):C23C14/24 主分类号 C23C14/24
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