发明名称 |
Method for manufacturing a workpiece carrier backing pad and pressure plate for polishing semiconductor wafers |
摘要 |
A carrier for semiconductor wafers to be polished comprises a backing pad vulcanized to a pressure plate. The backing pad is formed of a rubber material such as neoprene, SBR or natural rubber. An adhesive film of a thermosetting, thermally reactive material forms an integral bond between the backing pad and pressure plate. The backing pad, adhesive film and pressure plate together comprise a nearly ideally elastic assembly. The exposed face of the backing pad is profiled to a desired profile without effecting crumbling of the rubber material.
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申请公布号 |
US6095900(A) |
申请公布日期 |
2000.08.01 |
申请号 |
US19990276983 |
申请日期 |
1999.03.26 |
申请人 |
SPEEDFAM-IPEC |
发明人 |
FRUITMAN, CLINTON O.;CROSBY, THOMAS K.;SCHLUETER, JAMES |
分类号 |
B24B41/06;B24D18/00;(IPC1-7):B24B41/06;B24B1/00 |
主分类号 |
B24B41/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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