| 摘要 |
While a depression body supporting portion having a depression body depressing an upper surface of a semiconductor element is guided and supported by a support shaft, after a slide member arranged on the upper surface of the depression body supporting portion is depressed toward the upper surface of the semiconductor element, the slide member is slid in one direction relative to the upper surface of the depression body supporting portion to engage an engaging piece of the slide member to a connecting portion of the support shaft for maintaining depressed condition by the depression body.
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