发明名称 FLOOR HEATING DEVICE FOR OA FLOOR
摘要 PROBLEM TO BE SOLVED: To efficiently perform an indoor floor heating in a manner not to apply influences to a wiring by heating only the upper surfaces of protruding sections, by using an electric panel heating body for the floor heating, and also, roughly adjusting the size of the protruding sections to the size of the panel heating body. SOLUTION: A panel heating body 30 is provided on the upper surface of a protruding section 13 of an OA floor 10, and also, the wiring of the panel heating body 30 is formed in such a manner that the wiring may be performed through a gap 12. In the gap 12, a connecting terminal for the panel heating body 30 is provided. The wiring of the panel heating body 30 is performed by a sheet-form cord 33. As the panel heating body 30, one having a self temperature control function, which is covered with a PET film, is used.
申请公布号 JP2000213761(A) 申请公布日期 2000.08.02
申请号 JP19990015083 申请日期 1999.01.25
申请人 SANSO:KK;ITOCHU CORP;INTEC:KK 发明人 TAKAHASHI SEITARO;MORI SHINICHI
分类号 E04F15/024;E04F15/18;F24D13/02;F24D19/02;(IPC1-7):F24D13/02 主分类号 E04F15/024
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