| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a sample stage easy to work at a low cost and capable of holding a sample in the state with little deflection by providing a ring protruding part on a part of the upper surface of the sample stage, and placing the non-analyzing surface of the sample on the protruding upper surface partially in contact therewith. SOLUTION: In order to smooth the whole upper surface 2a of a sample stage 2, for example, the whole surface is not entirely polished, but ring-like protruding parts 3A, 3B, 3C having inside diameters of prescribed diameters of a sample 1, 6 inch, 8 inch or 300 mm or less are integrally formed on a part of the upper surface 2a of the sample stage 2, and only the upper surfaces 3Aa, 3Ba, 3Ca of the protruding parts 3A, 3B, 3C are polished so as to be flush. Accordingly, since the non-analyzing surface of the sample 1 is placed on the protruding part upper surfaces 3Aa, 3Ba, 3Ca partially in contact therewith, the working is facilitated at a low cost, and a disc-like sample 1 which is a semiconductor wafer can be held in the state with little deflection.</p> |
