发明名称 METHOD OF FORMING SILICA FILM AND MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To produce a highly reliable insulating film by supplying tetraethoxysilane(TEOS) having high purity and little impurities. SOLUTION: A method of forming a silica film includes the steps of introducing TEOS into an evaporation chamber 4 from a TEOS supply unit 18, introducing a carrier gas into the evaporation chamber 4, introducing a mixed gas of the TEOS and the carrier gas into a reaction chamber 5, introducing an oxidizing gas into the reaction chamber 5 from an oxidizing gas supply unit, heating a substrate in the reaction chamber to a desired temperature to form a silica film on the substrate, and discharging an exhaust gas from the reaction chamber. In this case, the TEOS supply unit 18 is provided with at least one optical liquid level sensor as a device for monitoring the amount of the TEOS.
申请公布号 JP2000208504(A) 申请公布日期 2000.07.28
申请号 JP19990010570 申请日期 1999.01.19
申请人 ASAHI DENKA KOGYO KK 发明人 NAKAGAWA SATOSHI;ONOZAWA KAZUHISA
分类号 G01F23/28;C23C16/40;C23C16/44;C23C16/448;H01L21/31;H01L21/316;(IPC1-7):H01L21/31 主分类号 G01F23/28
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