发明名称 CONTACT-FORMING METHOD FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which is stable and reduces the fluctuation or dispersion of characteristics, by suppressing the diffusion of an impurity inside a silicone substrate after compensation ion injection, and preventing the fluctuation of transistor characteristics or element separation characteristics. SOLUTION: An opening process for opening a contact hole 3 on the silicon substrate, a polysilicon depositing process for forming a polysilicon layer 5 by depositing polysilicon in the contact hole 3 formed by this opening process and on the surface of the silicon substrate, a compensation ion implantation process for injecting contact compensation ions into the polysilicon layer 5 deposited by this polysilicon depositing process, and an impurity diffusion process for diffusing the impurity from the inside of the polysilicon layer 5 to the silicon substrate by performing activation by heat treatment are performed in this order.
申请公布号 JP2000208619(A) 申请公布日期 2000.07.28
申请号 JP19990003228 申请日期 1999.01.08
申请人 SONY CORP 发明人 SUGANO MICHIHIRO
分类号 H01L21/768;H01L21/28;H01L21/336;H01L29/78;(IPC1-7):H01L21/768 主分类号 H01L21/768
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