发明名称 COOLING PARTS FOR ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the capability of cooling by forming cooling parts of copper alloy containing the specific amount of copper to which cold-working is applied at a specific working rate. SOLUTION: It is desirable that cold-working rate be 97% or more because cold-working is applied to copper alloy at the increasing working temperature of 250 deg.C or less to significantly decrease a thermal expansion coefficient. It is also desirable that the copper alloy containing copper of 50 wt.% or more contain copper of 70 wt.% or more, if possible, 80 wt.% or more. The copper alloy may be, for example, copper alloy containing Cr of 10 to 30 wt.%, copper alloy containing the suitable amount of at least one element from among B, N, C, Si, P, Mg, Co, Ag, Be, Al, Ni, Zn, Ti, Sn, and Zr in addition to the above Cr, copper alloy of a Cu-Mo group, or copper alloy of a Cu-Cr-Mo group. Thus, since copper of 50 wt.% or more is contained, thermal conductivity is high, the cold-working rate of 70% or more decreases a thermal expansion coefficient, which makes the copper alloy suitable for cooling semiconductor elements, etc.
申请公布号 JP2000208685(A) 申请公布日期 2000.07.28
申请号 JP19990006954 申请日期 1999.01.13
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 KIMURA NAOKI;NIEKAWA JUN;MIHARA KUNITERU
分类号 H01L23/373;C22C9/00;H01L23/427;(IPC1-7):H01L23/427 主分类号 H01L23/373
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