| 摘要 |
PROBLEM TO BE SOLVED: To realize the manufacturing method for a multilayer wiring board, which can easily make the roughening processing of a surface of an organic resin insulating layer of the wiring circuit board and can enhance the contact strength of the organic resin insulating layer and a wiring layer formed thereon. SOLUTION: An organic resin precursor layer 30 is semi-hardened, and roughening processing of the organic resin precursor layer 30 is made in the semi-hardened state where the roughening can easily be made. Additionally an organic resin insulating layer is made by having the organic resin precursor layer 30 harden completely after the completion of the roughening processing. Furthermore when the wiring layer is formed by a semi-additive method or a subtractive method, a thermal processing for perfect hardening may be made after forming a non-electrolytic plating layer or an electrolytic plating layer. |
