| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which shares another pattern and an external connection terminal connected to an electrode, having a common function between a plurality of semiconductor chips. SOLUTION: A semiconductor device 9 includes a first insulating film 4 formed on a semiconductor chip 1 to expose an Al pad 3 formed thereon, another pattern 5 formed on the surface of the first insulating film 4 and connected to the Al pad 3, a second insulating film 6 formed thereon so as to expose a junction 5a for an external connection terminal to be connected to the new pattern 5. A plurality of semiconductor chips 1 are arranged, and the pattern 5 has another pattern portion 5b between the Al pads 3 having a function in common with the chips 1, wherein a metal bump 8 of the chip 1 can be connected to the new pattern portion 5b. |
