发明名称 DETECTION OF DEFECTS ON PATTERNED SEMICONDUCTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To minimize the time overhead for mechanical X-Y stage movement. SOLUTION: In this defect detecting method, defects on a substrate are detected by a process for positioning an charged particle beam optical column 600, which has a field of view(FOV) with a resolution practically uniform over the entire column, with respect to a patterned substrate 622, a process for scanning the substrate while maintaining the optical charged particle beam column at a fixed position on the substrate, so as to capture images on the plural small areas of the substrate inside the FOV and a process for comparing the captured images with a reference image. By utilizing a large FOV image formation system, having the FOV with the resolution practically uniform all over the system, images can be captured over a wide range of the substrate without, requiring the movement of a mechanical X-Y stage 632 and time overhead for the mechanical stage movement can be reduced. In order to improve the throughput, plural columns may be linked as well.
申请公布号 JP2000208576(A) 申请公布日期 2000.07.28
申请号 JP20000002029 申请日期 2000.01.07
申请人 SCHLUMBERGER TECHNOL INC 发明人 TALBOT CHRISTOPHER G;LO CHIWOEI WAYNE
分类号 G01R31/302;G01B15/00;G01N21/00;G01N23/00;G01N23/04;G01N23/225;G01Q30/04;G01Q40/02;G01R1/06;G01R31/265;G01R31/305;H01J37/073;H01J37/20;H01J37/22;H01J37/256;H01J37/28;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01R31/302
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