发明名称 BINDING BAND
摘要 PROBLEM TO BE SOLVED: To improve working efficiency by realizing binding through a structure, where a projection is not generated at the external periphery of the bundled member in the binding band. SOLUTION: An opening hole 13 opening at one side end, a plurality of mount type projections 14 formed into a saw blade shape at the intermediate part of the external surface and arranged in parallel in the extending direction, a plurality of through-holes arranged in parallel in the extending direction between the opening hole 13 and mount type projection 14 line and bar type projections 16 erected in parallel in the extending direction at the internal surface of the front end side to be engaged with a stopper, when inserted to the through hole 15 are formed integrally with a resin material having flexibility to the long-length band 12.
申请公布号 JP2000209751(A) 申请公布日期 2000.07.28
申请号 JP19990006233 申请日期 1999.01.13
申请人 SUMITOMO WIRING SYST LTD 发明人 TATENO MITSUO
分类号 H02G3/30 主分类号 H02G3/30
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