Method for manufacturing electronic parts, method for manufacturing piezoelectric-resonant parts, electronic part, and piezoelectric-resonant part

摘要

There is provided a method for manufacturing electronic parts, comprising the steps of: obtaining a mother layered-product by laminating at least two motherboards by adhesive-printing on one of the motherboards; and obtaining each of the electronic parts by cutting said mother layered-product along a thickness direction thereof; wherein the adhesive-printing is performed in a manner such that the adhesive-printed area is provided with a plurality of pass-through openings over which an adhesive layer is not formed. The above method provides a reliable electronic part in which gaps are prevented from being produced in a section where an adhesive layer is thin, thereby avoiding an outer electrode from short-circuiting, or the like.