| 摘要 |
An electrical device has a printed-circuit board secured to a cover of the electrical-device housing, as well as a heat-dissipation mat arranged on a housing wall. The cover secured to the housing, as well as guideways of the housing, in which guideways the printed-circuit board is received, exert a tension force on the printed-circuit board, because of which electronic components arranged on the printed-circuit board, under conditions of intimate contact with the heat-dissipation mat, are embedded into the heat-dissipation mat. This is achieved by introducing the printed-circuit board in inclined position into the housing and, shortly before it reaches its final position, swivelling the printed-circuit board toward the wall of the housing having the heat-dissipation mat.
|
