| 摘要 |
A high frequency circuit structure including a base substrate having a planar face, a first base slotline mounted on the base substrate face and consisting of first and second, spaced-apart coplanar base conductors, and a circuit chip flip-mounted on the base substrate. The circuit chip include a chip substrate having a planar face facing the planar face of the base substrate. A slotline resident on the chip is flip mounted onto the base slotline. Input and output connections made according to the invention can be used to provide connections to an intermediate circuit resident on either the chip or the base substrate. A second chip slotline may be electrically in series or parallel with the first chip slotline.
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