| 摘要 |
PURPOSE: A method for manufacturing bumps is provided to prevent bump short from occurring beforehand as well as to increase the yield of the bump manufacturing process. CONSTITUTION: A method for manufacturing bumps includes following steps. At the first step, a seed metal layer(4) is formed on the surface of the wafer pad. At the second step, bump photo layer as well as a bump metal layer(6) are plated on the seed metal layer selectively. At the third step, the bump photo layer is etched by performing a pre-process before etching the seed metal layer. At the fourth step, the seed metal layer except for the bump metal layer is etched with an etchant so as to form a metal bump. The pre-process is performed using an oxygen plasma method to oxidate the surface of the wafer.
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