| 摘要 |
<p>A resin composition for dielectric layer formation and a film for dielectric layer formation, from each of which a dielectric layer having an even thickness can be easily formed by applying the composition or film to a desired part of a substrate and baking it. The dielectric layer thus formed neither contains residual carbon nor has craters. The resin composition is obtained by adding 100 to 500 parts by weight of a powder of an inorganic dielectric to 100 parts by weight of a self-adhesive resin which is obtained by polymerizing 80 to 100 wt.% C1-12 methacrylic ester with 0 to 20 wt.% other monomer copolymerizable therewith and optionally with 0.5 to 10 wt.% carboxylated monomer and has a weight-average molecular weight of 20,000 to 1,000,000 and a glass transition temperature of 15° C or lower. The film is obtained by spreading the resin composition on a flexible film.</p> |
