| 摘要 |
The invention relates to a method and a device for thermally connecting the contact surfaces (26, 27) of a contact substrate (11) comprising contact surfaces (28, 29) of a carrier substrate (12). The substrates (11, 12) are arranged in a connecting position in such a way that the contact surfaces (26, 28; 27, 29) are opposite each other on the connecting level. In order to reach the connecting temperature that is necessary for the connecting level, the contact substrate (11) is heated to the connecting temperature from the contact surface (26, 27) of the contact substrate (11). The substrate is impinged upon with laser energy in order to heat up the contact substrate (11). |
