MICROMACHINED DEVICE AND METHOD OF FORMING THE MICROMACHINED DEVICE
摘要
An apparatus (10) that includes a substrate (12) having first and second surfaces and a micromachined device (14) integral with the first surface (18) of the substrate (12), and wherein the second surface (20) is an outer portion of the apparatus (10). The apparatus (10) also has a cover (16) connected to the substrate (12). A method of forming a micromachined device (14) includes providing a substrate (12), fabricating the micromachined device (14) on the substrate (12), and connecting a cover (16) to the substrate (12).
申请公布号
WO0042636(A2)
申请公布日期
2000.07.20
申请号
WO2000US00670
申请日期
2000.01.11
申请人
TELEDYNE INDUSTRIES, INC.;STEENBERGE, ROBERT, W.;TAYLOR, WILLIAM, P.