发明名称 MICROMACHINED DEVICE AND METHOD OF FORMING THE MICROMACHINED DEVICE
摘要 An apparatus (10) that includes a substrate (12) having first and second surfaces and a micromachined device (14) integral with the first surface (18) of the substrate (12), and wherein the second surface (20) is an outer portion of the apparatus (10). The apparatus (10) also has a cover (16) connected to the substrate (12). A method of forming a micromachined device (14) includes providing a substrate (12), fabricating the micromachined device (14) on the substrate (12), and connecting a cover (16) to the substrate (12).
申请公布号 WO0042636(A2) 申请公布日期 2000.07.20
申请号 WO2000US00670 申请日期 2000.01.11
申请人 TELEDYNE INDUSTRIES, INC.;STEENBERGE, ROBERT, W.;TAYLOR, WILLIAM, P. 发明人 STEENBERGE, ROBERT, W.;TAYLOR, WILLIAM, P.
分类号 H01L23/055;H01L23/498 主分类号 H01L23/055
代理机构 代理人
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