| 摘要 |
<p>A lead frame or PCB (e.g. a ball grid array) has an array of IC package mounts (8a-c). At the head of each column an inclined line of reject markers (10a-c) is provided, one for each IC package mount in the column. Each reject marker (10) comprises an island joined to the remainder of the substrate by short tie-bars. The islands are broken out to indicate the corresponding IC mount or an IC package mounted there is a reject.</p> |
