| 发明名称 |
Polishing method for wafer and holding plate |
| 摘要 |
<p>A polishing method for wafer, comprises the steps of; adhering a wafer (W) to a wafer adhesion part of a holding plate (1) through a wax, and rubbing the wafer with a polishing pad (14), wherein the grooves (2) are formed on the wafer adhesion part and extend to the outside of the wafer adhesion part. <IMAGE></p> |
| 申请公布号 |
EP1020253(A2) |
申请公布日期 |
2000.07.19 |
| 申请号 |
EP20000300218 |
申请日期 |
2000.01.13 |
| 申请人 |
SHIN-ETSU HANDOTAI CO., LTD |
发明人 |
KOBAYASHI, DAISUKE;MATSUZAKI, TSUYOSHI;KUDO, H. |
| 分类号 |
H01L21/304;B24B37/30;H01L21/306;(IPC1-7):B24B37/04;B24B41/06 |
主分类号 |
H01L21/304 |
| 代理机构 |
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代理人 |
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| 主权项 |
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