WIRING BOARD CONSTRUCTIONS AND METHODS OF MAKING SAME

摘要

A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped in the top surface thereof. A conductor material is disposed within the recess, and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion helps to complete an electrically conductor path through the substrate to help complete an electrically conductive path through the substrate.