| 摘要 |
PROBLEM TO BE SOLVED: To avoid cracking which may occur in the reflow soldering process when a semiconductor device is packaged. SOLUTION: This semiconductor device provides not only the die bonding material 1, which bonds a supporting substrate, a semiconductor element 8, and another semiconductor element together, but also the sealing resin 9, which seals the semiconductor elements. The semiconductor element 8 is bonded to the lead frame by means of the film-type organic die bonding material 1, the properties of which are: a coefficient of water absorption of no more than 1.5 percent by volume, a coefficient of saturated moisture absorption of no more than 1.0 percent by volume, and a residual volatile content of no more than 3.0 percent by weight or elasticity modulus at 250 deg.C of no more than 10 MPa. |
