发明名称 |
EMI shielding enclosures |
摘要 |
An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.
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申请公布号 |
US6090728(A) |
申请公布日期 |
2000.07.18 |
申请号 |
US19980070994 |
申请日期 |
1998.05.01 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
YENNI, JR., DONALD M.;DE SOUZA, JOSEP.;BAKER, MARK G. |
分类号 |
H05K9/00;(IPC1-7):B32B15/08;B32B33/00;B32B27/04 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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