| 摘要 |
PROBLEM TO BE SOLVED: To enhance cooling efficiency by employing a multiplayer structure of an upper conductive layer, an insulating ceramic and a lower conductive layer in an insulating board and projecting the lower surface thereof downward thereby protecting the insulating board against damage due to thermal stress. SOLUTION: An insulating board 4 is made by bonding upper and lower conductive layers 3, 12 to the surface and rear surface of an insulating ceramic 2 and the lower surface thereof is projected downward. After being bonded with a semiconductor chip 1 through a solder layer 5, the insulating board 4 is secured, at the peripheral part thereof, from the surface and rear by means of bolts 14 using a supporting frame 17 comprising upper and lower supporting frames 15, 16 to adhere to a water-cooled or air-cooled heat sink 13 so that heat generated from the semiconductor chip 1 is released to the heat sink 13 through the insulating board 4. According to the structure, the insulating board 4 can be protected against damage due to thermal stress and cooling efficiency can be enhanced. |
