Method for producing a carrier element for semiconductor chips
摘要
A carrier element for a semiconductor chip, in particular to be built into smart cards. The carrier element has a substrate that carries the chip and a stiffening sheet which also carries the chip and has a recess for receiving the chip and its connection leads therein. An edge of the recess is provided with a frame formed integrally from the sheet.
申请公布号
US6088901(A)
申请公布日期
2000.07.18
申请号
US19980211107
申请日期
1998.12.14
申请人
SIEMENS AKTIENGESELLSCHAFT
发明人
HUBER, MICHAEL;STAMPKA, PETER;HOUDEAU, DETLEF;FISCHER, JUERGEN;HEITZER, JOSEF;GRAF, HELMUT