| 摘要 |
PURPOSE: A thin-film micromirror array-actuated(TMA) with improved via contact and manufacturing method thereof connect the second metal layer for intercepting for photo current to a drain pad of the first metal layer and form a via contact from an active layer to the second metal layer, thereby preventing the electrical open caused by contact defect between the via contact and the second metal layer and between the via contact and a bottom electrode. CONSTITUTION: One portion of the second metal layer(117) is extended downwards, then is connected with a drain pad of the first metal layer(113). A via hole(161) is formed by etching an active layer(157), a bottom electrode(155), a supporting layer(153), an etch stop layer(121) and the second passivation layer(119) in order. A via contact(163) of conductive metal such as tungsten, aluminum or titanium is formed inside the via hole(161) by using a sputtering method to electrically connect the second metal layer(117) with the bottom electrode(155). Therefore, the first signal applied from the external is applied to the bottom electrode(155) through a transistor inlaid in an active matrix(100), the drain pad of the first metal layer(113), the second metal layer(117) and the via contact(163).
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