METHOD FOR FORMING FUSE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for forming fuse of semiconductor device is provided to form fuse lines as contacts to melt them with low voltage, thereby simplify repair process. CONSTITUTION: A method for forming fuse of semiconductor device comprises steps of: forming a junction area in a fuse area of a semiconductor substrate and forming a first interlayer dielectric having a bit line contact hole; forming a bit line contact plug connected to the junction area through the contact hole; forming first/second bit lines connected to the contact plug and an outer power supply, respectively; forming a second interlayer dielectric having a storage electrode contact plug connected to the first bit lines and the junction area; forming a storage electrode connected to the storage electrode contact plug; forming a third interlayer dielectric having a metal wiring contact plug connected to the first/second bit lines; and forming a metal wiring connected to the metal wiring contact plug.