| 摘要 |
PURPOSE: A method and an apparatus for automatically bonding a tape carrier package and a thin film micro-mirror array by thermo-compression technology are provided. CONSTITUTION: First, a thin film micro-mirror array(TMA) is loaded onto a TMA jig(110) centrally positioned on a work table(130). Second, a tape carrier package(TCP) is loaded onto a TCP jig(120) adjacent to the TMA jig(110). The work table(130) is then moved so that the TMA and the TCP may be located underneath a thermo-compression head(140). While an anisotropic conductive film(ACF) is interlaid between both sets of leads of the TMA and the TCP, the thermo-compression head(140) presses down the leads simultaneously with applying heat. Next, the thermo-compression head(140) is moved upward and then returned to a starting position so that the next TCP may be loaded. In this manner, a thermo-compression bonding process is carried out continuously and automatically.
|
