METHOD FOR FABRICATING LTCC-M(LOW TEMPERATURE COFIRED CERAMIC-ON-METAL) MULTI-LAYERED PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for fabricating a LTCC-M(Low Temperature Cofired Ceramic-on-Metal) multi-layered PCB(Printed Circuit Board) is provided which can reduce the lamination process during the fabrication. CONSTITUTION: A method for fabricating a LTCC-M multi-layered PCB includes the steps of: forming an align groove on a metal substrate(300) and green tapes(400) respectively; laminating green tapes on the top of the metal substrate along the align grooves; forming a co-lamination by applying the pressure ranging from 100-140 Kgf/square centimeters quasi-isotropically the laminated metal substrate and the green tapes in a fixed temperature ranging from 80°C to 100°C; and firing the co-lamination with fixed temperature.