PREPARATION METHOD OF LOW TEMPERATURE COFIRED CERAMIC PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for preparing the low temperature cofired ceramic (referred as LTCC) printed circuit board is provided, to prepare the circuit whose passive elements have more precious value. CONSTITUTION: A method comprises the steps of colayering the circuit pattern-printed green tape (502) on the metal substrate (300) (step 1); firing the layered body (512) obtained at the step 1 (step 2); trimming the circuit pattern on the ceramic substrate (step 3); layering a green tape (502) or a layered body (512) on the trimmed ceramic substrate (step 4); and firing the layered body obtained at the step 4 (step 5). The process from step 1 to step 3 is repeated as many as the number of green tapes where a circuit pattern requiring the trimming is printed. Preferably the circuit pattern has passive elements such as a resistor or a capacitor.