发明名称 FABRICATION METHOD OF IMAGE SENSOR HAVING PINNED PHOTODIODE
摘要 PURPOSE: A fabrication method of an image sensor having a pinned photodiode is to enhance optical sensitivity and depress the potential barrier formed at the channel region of the transfer transistor. CONSTITUTION: A fabrication method of an image sensor comprises the steps of: providing a semiconductor layer(11) having a first conductive type; forming an isolation insulating layer(13) and a gate electrode(15) of a CMOS(Complementarily metal oxide semiconductor) transistor on the semiconductor layer; forming a first ion-implanted layer(16) having a second conductive type opposite to the first conductive type in the semiconductor layer of where a pinned photodiode is being formed; forming a mask pattern(20) in which an upper portion of the first ion-implanted layer and an edge of the insulating isolation layer are exposed; etching exposed portion of the insulating isolation layer using the mask as etch stopper; and forming a second ion-implanted layer(21) having the first conductive type below the exposed surface of the semiconductor layer using the mask as ion implanting barrier.
申请公布号 KR20000041452(A) 申请公布日期 2000.07.15
申请号 KR19980057311 申请日期 1998.12.22
申请人 HYUNDAI ELECTRONICS IND. CO., LTD. 发明人 PARK, SANG HUN
分类号 H01L31/10;H01L27/13;H01L27/14;(IPC1-7):H01L27/13 主分类号 H01L31/10
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