FEEDING DEVICE FOR DIE BONDING EPOXY OF SEMICONDUCTOR

摘要

PURPOSE: An epoxy supplying device for die bonding a semiconductor device is provided to improve the productivity and to reduce the manufacturing cost by reducing the fault rate of the semiconductor device. CONSTITUTION: An epoxy supplying device for die bonding a semiconductor device comprises a pen(11) formed with an epoxy supplying hole(11a). Epoxy is accommodated in the pen(11). A piston(13) is installed at an upper end of the pen(11). An air feeding pipe(16) is installed at a rear of the pen to move the piston(13) by feeding the air into the pen(11). A ball(12) is provided in the epoxy supplying hole(11a) so as to close or open the epoxy supplying hole(11a). A cap(14) is installed on an upper portion of the pen(11). A fixing nut(15) is mounted at a periphery of the pen(11).