| 摘要 |
PROBLEM TO BE SOLVED: To improve efficiency through reduction in the number of times of cleaning a mold, by sealing a semiconductor wafer, which has an electrode post, by the compression molding of a resin composition, exposing the top of the electrode post. SOLUTION: A mold which is heated to a desired temperature is opened, and a semiconductor wafer 2 is fixed in a lower mold 12, and also the periphery of a fluorocarbon mold releasing film 3 is fixed to an upper mold 11, and a sealing resin composition 4 is supplied onto the semiconductor wafer 2. Then, the mold is closed, and sealing resin 4 is molded through compression, and surplus resin is discharged from a particle line. In the early stages of this compression molding, the sealing resin 4 is compressed to flow, and a mold releasing film 3 is elongated by making frictional force act on the mold releasing film 2, and then the sealing resin 4 is hardened under a specified condition. Then, after opening the mold and the separating the mold releasing film 3, the semiconductor wafer 2 is taken out, thus sealing of the semiconductor wafer 2 with resin is finished.
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