| 摘要 |
PROBLEM TO BE SOLVED: To cope with the exothermic density increase of an electronics module by raising the cooling capacity of the electronics module in low flow range, without increasing the flow of the refrigerant flowing in a cooling pipe. SOLUTION: High heat conduction capacity can be obtained by providing this apparatus with a step difference in the direction of a refrigerant by inserting a coil spring so that it may contact with the inwall of the passage of a cooling pipe 3, and making the flow into turbulence compulsively even in a low flow range. Moreover, the cooling area enlargement effect can also be obtained by joining the coil spring 8 to the inwall of the cooling pipe 3 by a brazing or the like. What is more, the heat conduction capacity can be set in wide range by the line diameter or the winding pitch of a coil spring 8.
|
