发明名称 METHOD AND DEVICE FOR SHAPING SOLDERING FORM OF CREAM SOLDER PRINTED ON PRINTED BOARD AND METHOD AND DEVICE FOR STORING PRINTED BOARD PRINTED WITH CREAM SOLDER
摘要 PROBLEM TO BE SOLVED: To provide means and device for shaping soldering form capable of improving forms of cream solder, by shaping soldering shape of cream solder printed on a printed board to prevent solder leakage in the lateral direction, keeping a good quality even after a long period of standby for mounting, and, moreover, positively putting the solder under vibration; and also to provide method and device for storing printed board. SOLUTION: A printed board printed with cream solder is turned over so that the printed surface of the cream solder is downward by a turning-over machine 12. Then, the board is vibrated by a vibrator 13 to shape the cream solder. Moreover, when it takes long time from printing till mounting due to a trouble or the like in a proceeding processes, the board is kept in a sealed container sealed in a saturated atmosphere of nitrogen gas.
申请公布号 JP2000196233(A) 申请公布日期 2000.07.14
申请号 JP19980369761 申请日期 1998.12.25
申请人 RICOH MICROELECTRONICS CO LTD 发明人 KINOSHITA SHINGEN
分类号 H05K3/34;B41M7/00;(IPC1-7):H05K3/34 主分类号 H05K3/34
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