| 摘要 |
PROBLEM TO BE SOLVED: To prevent warpage of a circuit board housing and ensure a high reliability, without adversely influencing semiconductor chips, etc., by absorbing strains due to internal stresses caused in a resin molding of a connector with the circuit board housing through a part of outer leading terminals exposed to the outside. SOLUTION: A circuit board housing 23 is separated by a gap 31 from a connector 24, approximately a middle part 28c of an external leading terminal 28 is exposed in this gap 31, and the circuit board housing 23 is connected with the connector 24 via the middle part 28c. Since the circuit board housing 23 is connected with the connector 24 via the middle part 28c of the terminal 28, strains due to internal stresses caused in a resin molding can be absorbed with a part of outer leading terminals exposed to the outside. This eliminates warpage of the thinner-walled circuit board housing 23 after its resin molding as compared to the thick-walled connector 24. |
