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发明名称
A method of manufacturing a semiconductor device including a trench
摘要
申请公布号
GB2345578(A)
申请公布日期
2000.07.12
申请号
GB20000000562
申请日期
2000.01.11
申请人
* NEC CORPORATION
发明人
HIDEKAZU * HASEGAWA
分类号
H01L21/76;H01L21/265;H01L21/334;H01L21/762;(IPC1-7):H01L21/76
主分类号
H01L21/76
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