发明名称 Patterning method
摘要 In a layer structuring process using a mask, re-deposited layer material is removed with sonic assistance. A layer structuring process comprises (a) structuring a layer using a mask; (b) optionally removing the mask, preferably by ashing a lacquer mask; and (c) removing re-deposited layer material and the mask (if still present) with sonic assistance. Preferred Features: Sonic assistance is provided by an ultrasonic bath, a megasonic unit or a sonic liquid jet.
申请公布号 EP0907203(A3) 申请公布日期 2000.07.12
申请号 EP19980114639 申请日期 1998.07.30
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 ENGELHARDT, MANFRED DR.;WEINRICH, VOLKER, DR.
分类号 C23F4/00;H01L21/02;H01L21/302;H01L21/306;H01L21/3065;H01L21/31;H01L21/311;H01L21/3213 主分类号 C23F4/00
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