发明名称 |
Patterning method |
摘要 |
In a layer structuring process using a mask, re-deposited layer material is removed with sonic assistance. A layer structuring process comprises (a) structuring a layer using a mask; (b) optionally removing the mask, preferably by ashing a lacquer mask; and (c) removing re-deposited layer material and the mask (if still present) with sonic assistance. Preferred Features: Sonic assistance is provided by an ultrasonic bath, a megasonic unit or a sonic liquid jet. |
申请公布号 |
EP0907203(A3) |
申请公布日期 |
2000.07.12 |
申请号 |
EP19980114639 |
申请日期 |
1998.07.30 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
ENGELHARDT, MANFRED DR.;WEINRICH, VOLKER, DR. |
分类号 |
C23F4/00;H01L21/02;H01L21/302;H01L21/306;H01L21/3065;H01L21/31;H01L21/311;H01L21/3213 |
主分类号 |
C23F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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