发明名称 PREPARATION OF PREPREG SHEET FOR USE IN PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a prepreg sheet which improves a resin yield in paper making without damaging insulating properties and heat resistance required for a laminated board. SOLUTION: This is a method for producing a prepreg sheet by subjecting a material having a base fiber and an uncured thermosetting resin powder as a major component to a wet type paper making, followed by drying with heating, wherein the average particle size of the uncured thermosetting resin powder is 50-200μm, the ratio of minute particles which are <=10μm is <=10 wt.%, and the ratio of coarse particles which are <=300μm is <=10 wt.%.
申请公布号 JP2000191808(A) 申请公布日期 2000.07.11
申请号 JP19980372349 申请日期 1998.12.28
申请人 OJI PAPER CO LTD 发明人 YOKOYAMA HIDEKUNI
分类号 H05K1/03;C08J5/24;D21H17/52;D21H17/53;H05K3/46;(IPC1-7):C08J5/24 主分类号 H05K1/03
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