| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition having good flowability, moisture resistance and flame retardancy and useful for sealing semiconductors to give semiconductor devices high in reliability by compounding an epoxy resin, a phenolic resin, and a specific composite metal hydroxide. SOLUTION: This resin composition comprises (A) an epoxy resin, (B) a phenolic resin, and (C) a polyhedral composite metal hydroxide of the formula: m(MaOb).n(QdOe).cH2O [M, Q are each a metal element; Q is a metal element belonging to the group IVa, Va, VIa, VIIa, VIII, Ib, or IIb in the periodic table; (m), (n>, (a)-(e) are each a positive number] having a chloride ion content of <=5μm/g in water, when extracted with the water at 160 deg.C for 20 hr. The component C in the composition preferably has a particle distribution comprising (i) 10-35 wt.% of particles having particle diameters of <1.3μm, (ii) 50-65 wt.% of particles having particle diameters of 1.3-2.0μm and (iii) 10-30 wt.% of particles having particle diameters of >=2.0μm.
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