| 摘要 |
A shield for a PCB package for shielding electromagnetic radiation from exiting or entering the package. Typically, the package includes first and second electrically conductive covers and first and second frames. A printed circuit board fits within the shield, and the shield fits within the first and second covers and frames. The shield has side walls which surround a perimeter of the printed circuit board so as to prevent electromagnetic radiation from entering and exiting through the first and second frames of the package. The shield also has ground springs which electrically connect the shield with the first and second covers so as to insulate the printed circuit board from electromagnetic radiation radiating to and from directions perpendicular to planes of the first and second covers. The shield also includes side springs which attached to the side walls and press against a side edge of one of the first and second frames so as to secure the shield within the package. Optionally, the shield can include ground clips attached to the side walls which contact the printed circuit board so as to electrically connect the printed circuit board to the shield. A further option is to provide a removed portion in one of the side walls so as to enable a connector of an input/output device to pass through the side wall of the shield.
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