发明名称 Method of manufacturing an extended height insulative housing for an electrical connector
摘要 <p>A method for molding an elongated insulative housing (10) comprising the steps of injecting a molding compound in a mold cavity, then allowing the molding compound to cure and then removing the housing from the mold cavity wherein a transverse molding compound flow restriction means in the mold cavity is provided. It is found that this method reduces bow and warp in the finished housing (10). &lt;IMAGE&gt;</p>
申请公布号 EP1017139(A2) 申请公布日期 2000.07.05
申请号 EP19990125991 申请日期 1999.12.28
申请人 BERG ELECTRONICS MANUFACTURING B.V. 发明人 REILAND, KEITH F.;TEKELY, PATRICK F.
分类号 C08J3/00;H01R43/24;H01R43/18;(IPC1-7):H01R43/18 主分类号 C08J3/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利