发明名称 |
Method of manufacturing an extended height insulative housing for an electrical connector |
摘要 |
<p>A method for molding an elongated insulative housing (10) comprising the steps of injecting a molding compound in a mold cavity, then allowing the molding compound to cure and then removing the housing from the mold cavity wherein a transverse molding compound flow restriction means in the mold cavity is provided. It is found that this method reduces bow and warp in the finished housing (10). <IMAGE></p> |
申请公布号 |
EP1017139(A2) |
申请公布日期 |
2000.07.05 |
申请号 |
EP19990125991 |
申请日期 |
1999.12.28 |
申请人 |
BERG ELECTRONICS MANUFACTURING B.V. |
发明人 |
REILAND, KEITH F.;TEKELY, PATRICK F. |
分类号 |
C08J3/00;H01R43/24;H01R43/18;(IPC1-7):H01R43/18 |
主分类号 |
C08J3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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