FLIP CHIP MOUNTING METHOD AND PRINTED CIRCUIT BOARD FOR APPLYING SAME

摘要

PURPOSE: A flip chip mounting method and printed circuit board(PCB) for applying the method is provided to enhance an adhesive force between the electrode pad of the PCB and the electrode bump of the flip chip upon mounting the flip chip. CONSTITUTION: A flip chip mounting method comprises the steps of: selectively coating a conductive adhesive on either a conductive electrode pad(110) of a PCB substrate(100) or a conductive electrode bump(210) of a flip chip(200); coating a conductive adhesive(111) on at least one region of either a region other than the conductive electrode pad of the PCB or a region other than the conductive bump of the flip chip; and gluing the conductive electrode bump onto the conductive electrode pad of the PCB. The PCB further comprises a subsidiary pad(120) on the region other than the conductive electrode pad and the conductive adhesive is attached on the subsidiary pad.