发明名称 METHOD FOR FABRICATING CAPACITOR OF SEMICONDUCTOR DEVICE
摘要 PURPOSE: A method for manufacturing a capacitor of a semiconductor device is provided to increase the capacitance of the capacitor by maximizing the surface area of a lower electrode of the capacitor. CONSTITUTION: A first insulation film(32) having a plurality of contact holes(34) is formed on a semiconductor substrate(31). A second insulation film(36) and a mask layer are formed on the semiconductor substrate(31). A plurality of plugs(35) are formed in the contact holes(34). A plurality of first mask patterns(37) are formed between the plugs(35). By selectively removing the first mask patterns(37), a second mask patterns(38) are formed. Then, the second insulation film(36) is etched so as to expose the plug(35). A conductive layer and a third insulation film(41) are sequentially on the semiconductor substrate(31). A capacitor lower electrode(40a) is formed by removing materials positioned on the upper portion of the second insulation film(36). A dielectric film(42) and an upper electrode(43) are formed on the lower electrode(40a).
申请公布号 KR20000040060(A) 申请公布日期 2000.07.05
申请号 KR19980055605 申请日期 1998.12.17
申请人 HYUNDAI MICRO ELECTRONICS CO., LTD. 发明人 KANG, TAE WOONG
分类号 H01L27/108;H01L21/02;H01L21/321;H01L21/8242;(IPC1-7):H01L27/108 主分类号 H01L27/108
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