Hinge for electronic apparatus and electronic apparatus equipped with hinge

摘要

Disclosed is a hinge for electronic apparatus which is capable of effecting heat dissipation without having to increase the size of the electronic apparatus. Hinges 1A and 1B for electronic apparatus are provided for the purpose of foldably connecting a first portion 2 and a second portion 3 of an electronic apparatus. Each hinge includes a stationary member 11 which has a strength maintaining portion 11a for maintaining mechanical strength and a heat conducting portion 12 for effecting heat conduction and which is provided on the first portion 2, a movable member 17 which has a strength maintaining portion 17a for maintaining mechanical strength and a heat conducting portion 13 for effecting heat conduction and which is provided on the second portion 3, and a joint portion 30 for joining the stationary member 11a and the movable member 17 to each other while effecting heat conduction between the heat conducting portion 11a of the stationary member and the heat conducting portion 13 of the movable member.