发明名称 Continuous mode solder jet apparatus
摘要 A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.
申请公布号 US6082605(A) 申请公布日期 2000.07.04
申请号 US19990388032 申请日期 1999.09.01
申请人 MICRON TECHNOLOGY, INC. 发明人 FARNWORTH, WARREN M.
分类号 B23K3/06;B23K20/00;B23K35/14;B41J2/09;H01L21/00;H01L21/607;H05K3/34;(IPC1-7):B23K1/00;B23K31/02;B23K35/12;B05B1/08 主分类号 B23K3/06
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