| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a support mechanism and support method for a substrate for film formation, which can carry the filmed substrate out, without damaging the filmed substrate and the film formed thereupon. SOLUTION: A support mechanism 20 is equipped with a stage 21, a shaft member 22, and support pins 23 and 24. When a substrate M is mounted on the stage 21 which is held horizontally, the shaft member 22 rotates and the stage 21 is lifted up to a filming position, where the mount surface 21a becomes nearly perpendicular. After a film is formed at the filming position, the support pins 23 and 24 provided to the stage 21 are moved to prevent the thin film formed on the substrate M from peeling and the substrate M from cracking or chipping.</p> |
